In this episode of Micro Journeys, host Daniel Marrujo sits down with Dave Shahin of Northrop Grumman to explore the cutting-edge world of microelectronics and advanced packaging. From his early fascination with building things to his current leadership role at Northrop Grumman’s Microelectronics Center, Dave shares a journey that spans from ceramic engineering to semiconductor innovation — and ultimately to shaping the future of defense and commercial technology.
Diving deeper, Dave discusses the critical role advanced packaging plays in connecting and integrating semiconductor components, enabling greater performance, miniaturization, and reliability. He explains how Northrop Grumman’s open-access manufacturing model is reshaping the U.S. defense and commercial landscape — creating trusted, onshore capabilities that bridge national security needs with commercial innovation.
Ultimately, Dave reveals how Northrop Grumman is building a secure, scalable microelectronics ecosystem that partners across the industry to meet national priorities. Through flexibility, scale, and collaboration, the company is ensuring America’s semiconductor independence and leadership in next-generation technologies.